The evolution of xTCA

2002

The first standard for the xTCA series, PICMG 3.0 – AdvancedTCA (Advanced Telecommunication Computing Architecture) was adopted in 2002. AdvancedTCA defines systems for telecommunications, specifically for use in the central office. With a surface area of 360 cmē (280 * 322 mm) and a width of 6 HP, the extra large boards permit maximum computing capacity. The serial data transfer, which can be set up as dual star, dual-dual star, full mesh or replicated mesh, can achieve incredible data transfer rates of up to 2.5 Tb/s (terabits per second). The specification is completed by effective shelf management and full redundancy, facilitating system availability of up to 99.999%. There is an assurance that system component failures will be detected reliably, with the relevant information being forwarded to a system management software program.

2004

A second xTCA specification, PICMG AMC.0 – AdvancedMC (Advanced Mezzanine Card), was adopted in 2004. These compact functional modules take the modularity and flexibility of the AdvancedTCA blades to the next level. The AdvancedMC modules can be connected from the front, feature EMC protection, support hot-swapping, and are integrated into the AdvancedTCA shelf management concept. The modules are used in special AdvancedTCA blades, known as carriers, which have the same form factor as an AdvancedTCA blade. Three different widths have been defined for the modules, compact (3 HP), mid-size (4 HP) and full-size (6 HP), plus two heights, single (approx. 75 mm) and double (approx. 150 mm).

AdvancedTCA Shelf

Advanced Mezzanine Cards

ATCA Shelf With AMC Carrier

2006

The third xTCA specification, PICMG MTCA.0 – MicroTCA (Micro Telecommunications Computing Architecture), was published in 2006. The objective of the MicroTCA specification was to create systems which were not only smaller and more flexible but also less powerful than the larger AdvancedTCA systems. These would be designed for less data throughput typical of the edge and access areas of telecommunications networks, offering maximum functionality and taking the place of AdvancedTCA components. MicroTCA uses AdvancedMC modules but without carriers; the modules are integrated directly into the system, where they serve as function cards. A carrier and shelf management concept was also defined to detect component failures and respond to or report events. Provision has also been made for redundancy.

Right from the start MicroTCA aroused significant interest not only in the field of telecommunications but also on other markets, including industrial automation, test & measurement, and the military market. However, the prevailing environmental conditions on these markets differ, often placing more stringent requirements on shock and vibration resistance. In response, work started on three MicroTCA secondary specifications. The first, PICMG MTCA.1 – Rugged MicroTCA (Air Cooled Rugged MicroTCA) for air-cooled industrial applications, was released just this year.

Work on drafting PICMG MTCA.2 (Hardened Air Cooled MicroTCA) for air-cooled military applications will start once PICMG MTCA.3 (Hardened Conduction Cooled MicroTCA) for conduction-cooled military applications is complete. The working group is currently occupied with the specification for MicroTCA.3.

Redundant MicroTCA System

1 U MicroTCA System

Rugged MicroTCA Cube