Conduction Cooled MicroTCA.3

For extreme environments, a completely sealed and hardened enclosure is required. This means a completely different packaging solution is implemented. The goal of the MicroTCA.3 rugged committee is to not modify the AMC module itself nor change the MicroTCA backplane connector.

First, the AMC module is enclosed or framed with an aluminum clamshell or frame that is then assembled with two Wedge-Loks. These Wedge-Loks provide the clamping force inside the cold wall rails inside the enclosure to provide the necessary resistance to the highest shock and vibration conditions as well as conduct the thermal energy from the AMC to the exterior cooling fins of the enclosure.

Robust MicroTCA enclosure for military use

AdvancedMC clamshell

The AMC module is encapsulated into an aluminum clamshell. A skyline profie of the board is created and machined into the aluminum part that makes contact to each hot components similar to how a heat sink would be designed and mounted. A thermally conductive paste is applied as a gap filler between the aluminum part and the board component. The standard AMC front panel does not need to be removed and is used within the assembly.

During application use, the thermal energy of each component is then transfered from the case of the component through the pedestal of the clamshell and then into the coldwall of the enclosure as shown in the below diagram.

Clamshell diagram

AMC module with clamshell and thermally conductive paste

This view shows the inside of a conduction cooled enclosure with the top and side plates removed. A standard MicroTCA backplane is used and a clamshell AMC module is shown being installed.

Inside of a conduction cooled enclosure

This picture provides a view of the AMC clamshell and Wedge-Lok assembly as it is locked into the cold wall rail with integrated cooling fins.

Conduction cooled AMC clamshell with Wedge-Lok