STRAUBENHARDT – Backplanes have become a central component of integrated, computer-controlled systems. As complexity and transfer rates continue to increase, the demands placed on development, layout, production, testing, validation and simulation also continue to grow. However, costs do not necessarily also have to increase, as Schroff demonstrates with its range of standard backplanes for a variety of transfer technologies. Investments in a modern machine facility have allowed a reduction in production costs, as a result of which the list prices for standard VME, VME64x and CompactPCI backplanes have already fallen by up to 20 %.

Schroff is currently the only backplane manufacturer to apply the 'conformal coating', a special fluorescent protective coating on the board, using special equipment in its own production facility. The result for the customer is not only time-saving and flexibility but also cost advantages. Another example of the efficient use of modern production technologies is a new solder paste printer that does not use stencils. Around 500 solder points per second, which works out at 1.8 million solder points per hour, are completed by the printer, precisely and reproducibly. Schroff's sensible investment in modern manufacturing technology, however, not only means reduced costs, but also improved product quality. Despite its high processing speed, the solder paste printer produces far fewer errors than occur with conventional screen printing. Less solder paste is required, which further lowers costs and is more environmentally friendly. Thanks to the high precision of the printer, the reworking and repairs to printed boards that used to occur frequently are no longer necessary. And since the previously required stencils are no longer needed, product changes can be carried out quickly and simply. This not only saves the cost of the stencils but also eliminates the three-day wait for their delivery.