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Packaging Solutions for AdvancedTCA, MicroTCA and AdvancedMCNew guide |
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In January 2008 a new guide to the three recently published standards AdvancedTCA, AdvancedMC and MicroTCA was compiled by Schroff GmbH, one of the leading members of the PICMG consortium. The 88-page document is clearly laid out, enabling users (looking for totally reliable computer systems able to support high data transfer rates for use in telecommunications applications or complex automation tasks, for example) to glean all the information they need at a glance.
As well as describing the fundamentals of the three standards with specific reference to mechanical requirements and benefits, the guide contains information about possible areas of application. It also describes the various backplane topologies which can be used. Furthermore, the guide contains detailed information about all products on offer from Schroff, including AdvancedTCA and MicroTCA complete systems, Shelf Manager, AdvancedTCA carrier equipment, MicroTCA development systems and MicroTCA subracks, backplanes, front panels and power supply solutions. A number of pages are devoted to various cooling systems based on air and air/water concepts for subrack and cabinet installation. The guide is rounded off with information about product support services grouped under the ServicePLUS banner. The new Packaging Solutions guide is available in English, French, German and Russian. To get your copy, go to www.Schroff.biz. |
![]() The AdvancedTCA – MicroTCA – AdvancedMC Guide |
Author: Schroff GmbH sro803, 01/2008 |
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