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MicroTCA is a modular platform for the development of telecommunications, business and network applications.
The PICMG® MicroTCA Standard, for which Schroff lead the development of the mechanics, defines the demands of a system, where Mezzanine Boards (AdvancedMCs) are assembled directly on a backplane.
Outside the telecommunications sector too, MicroTCA systems have the potential to replace proprietary solutions and reduce development costs considerably with their flexible and modular design.
Based on this new standard Schroff has developed a complete product range with MicroTCA complete systems.
The PICMG® MicroTCA Standard, for which Schroff lead the development of the mechanics, defines the demands of a system, where Mezzanine Boards (AdvancedMCs) are assembled directly on a backplane.
Outside the telecommunications sector too, MicroTCA systems have the potential to replace proprietary solutions and reduce development costs considerably with their flexible and modular design.
Based on this new standard Schroff has developed a complete product range with MicroTCA complete systems.
The MicroTCA complete Systems are available in different sizes
The systems are available with 2 and 4 U high board cages, 200 mm depth as well as in various widths. The systems consist of a chassis, a MicroTCA Carrier Hub (MCH) (optionally two for redundant operation), power modules (PMs) with selectable redundancy and load distribution, a cooling unit (optionally redundant) and a backplane. The backplane is configured in star topology and with its high speed connections is suitable for different protocols. If required, each system can be upgraded with cooling units. The basic configuration of an assembled MicroTCA systems consists of an AdvancedTCA module, a MicroTCA Carrier Hub, a backplane and a power supply. In the largest MicroTCA system offered by Schroff twelve AdvancedMC modules can be assembled.
During the development of the MicroTCA complete systems particular attention was paid to carefully thought-out cooling concepts. Based on the heat created by the processors a maximum heat loss of 80 W per AdvancedMC module was defined in the standard. For higher cooling requirements Schroff has integrated liquid cooling in its MicroTCA platform systems. With direct cooling of the area where the heat is created, i.e. direct cooling of the components (the AMC modules) Schroff realises a hybrid solution, combined water and air cooling in the chassis. The critical components on the board are cooled directly with water cooling units. The heat, which is created by the remaining electronic components on the board, can easily be expelled with conventional air cooling. Above and below the board cage is a distribution system, from which the slots of the MicroTCA systems can be supplied with cooling fluid. The inlet and outlet pipes for the water cooling units on the boards are lead to the front to drip-free valves in the front panel of the plug-in unit.
The required high availability of such systems has been secured through the redundant cooling concept. This means, that the failure of a fan does not interrupt the operation of the system. Furthermore the NEBS standard valid in the USA (Network Equipment Building Standard) and the European ETSI standard (European Telecom Standard Institute) with their strict limits for noise generation of the system, were adhered to. The demand by users for a compact assembly height of the MicroTCA systems and with the possibility to assemble a lot of equipment in the smallest space was considered during the development of the product and optimally realised.
During the development of the MicroTCA complete systems particular attention was paid to carefully thought-out cooling concepts. Based on the heat created by the processors a maximum heat loss of 80 W per AdvancedMC module was defined in the standard. For higher cooling requirements Schroff has integrated liquid cooling in its MicroTCA platform systems. With direct cooling of the area where the heat is created, i.e. direct cooling of the components (the AMC modules) Schroff realises a hybrid solution, combined water and air cooling in the chassis. The critical components on the board are cooled directly with water cooling units. The heat, which is created by the remaining electronic components on the board, can easily be expelled with conventional air cooling. Above and below the board cage is a distribution system, from which the slots of the MicroTCA systems can be supplied with cooling fluid. The inlet and outlet pipes for the water cooling units on the boards are lead to the front to drip-free valves in the front panel of the plug-in unit.
The required high availability of such systems has been secured through the redundant cooling concept. This means, that the failure of a fan does not interrupt the operation of the system. Furthermore the NEBS standard valid in the USA (Network Equipment Building Standard) and the European ETSI standard (European Telecom Standard Institute) with their strict limits for noise generation of the system, were adhered to. The demand by users for a compact assembly height of the MicroTCA systems and with the possibility to assemble a lot of equipment in the smallest space was considered during the development of the product and optimally realised.
