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5 U 6-slot AdvancedTCA system with 40 G backplane
Double the data rates: On the information superhighway at 40 Gbit/s
Schroff is one of the first manufacturers to introduce a new series of standard AdvancedTCA systems with 40G backplanes (four 10G ports in parallel) to the market. This represents almost a doubling of data transfer rates compared to the current AdvancedTCA generation. The basis for this change in technology are AdvancedTCA boards with yet faster chipsets (10 Gbit/s Ethernet) and ever-higher transfer rates together with the demands of customers for higher data rates, e.g. for video on demand, video conferencing, webinars etc. Back at the end of 2009 some manufacturers were announcing the start of production of AdvancedTCA boards with such 40G-ready chipsets for autumn 2010. Schroff, however, has already done so.
AdvancedTCA system with 40 G backplane
As well as finding application in all areas of telecommunications, these systems are also suitable for the enterprise market - that is, for measurement and instrumentation, for video on demand and for evaluating and testing correspondingly fast boards.
The system complies with AdvancedTCA specification PICMG 3.0 revision 3.0 and offers space at the front for six 8 U high, 6 HP deep boards mounted horizontally. The same number of rear I/O boards can be fitted to the rear. The system features a triple replicated mesh backplane with a data transfer rate of 40 Gbit/s. The backplane has two hub slots and four node slots. An IPMB (intelligent platform management bus) can be used, either radial or bussed. Two type ACB V shelf managers and one shelf alarm panel (SAP module) can be fitted into the system.
Two redundant, hot swap-capable fan trays, on the left and right in the system (on the push-pull principle) and with six fans each, provide cooling for the boards. The AdvancedTCA specification requires 200 W cooling capacity per front board. Schroff's cooling solution in fact provides over 350 W cooling per front board and thus contains capacity to accommodate future developments. The rear I/O boards are likewise suitable cooled. A filter mat ensures that no dust or dirt can enter the system.
In this system the power consumption per board is about 350 W, for which two redundant -48 VDC/-60 VDC power entry modules are available. The modules are protected by circuit breakers rather than by fuses.
The new systems consist of a shielded 19" subrack in zinc-plated steel plate. The front is finished in RAL 9005 (black). These AdvancedTCA systems will be available from stock from June 2010.
The system complies with AdvancedTCA specification PICMG 3.0 revision 3.0 and offers space at the front for six 8 U high, 6 HP deep boards mounted horizontally. The same number of rear I/O boards can be fitted to the rear. The system features a triple replicated mesh backplane with a data transfer rate of 40 Gbit/s. The backplane has two hub slots and four node slots. An IPMB (intelligent platform management bus) can be used, either radial or bussed. Two type ACB V shelf managers and one shelf alarm panel (SAP module) can be fitted into the system.
Two redundant, hot swap-capable fan trays, on the left and right in the system (on the push-pull principle) and with six fans each, provide cooling for the boards. The AdvancedTCA specification requires 200 W cooling capacity per front board. Schroff's cooling solution in fact provides over 350 W cooling per front board and thus contains capacity to accommodate future developments. The rear I/O boards are likewise suitable cooled. A filter mat ensures that no dust or dirt can enter the system.
In this system the power consumption per board is about 350 W, for which two redundant -48 VDC/-60 VDC power entry modules are available. The modules are protected by circuit breakers rather than by fuses.
The new systems consist of a shielded 19" subrack in zinc-plated steel plate. The front is finished in RAL 9005 (black). These AdvancedTCA systems will be available from stock from June 2010.
Author:
sro1009, 04/2010