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Electronics Packaging is much more than empty 19" subracks and cases. At Schroff, we understand system-level integration, integration of electromechanical and electronic components, like cabling, switches, backplanes, power supplies, monitoring units or thermal management solutions along with EMC measures electronic system.
CompactPCI systems for horizontal board assembly
Typically with the CompactPCI systems for horizontal board assembly Schroff offers a fully integrated solution. These compact, space saving plug-in units are available in 1 U, 2 U, 3 U versions and now also as a 4 U version. In the 4 U version there is space for up to eight horizontal 160 mm deep boards. A system slot is at the bottom which allows to use CPUs with double width (8 HP). Additionally, there is assembly space at the rear for 80 mm deep Rear-I/O boards with IEEE guide rails including ESD clip. At the left side of the system is a front extractable hot-swap fan unit with four especially low noise fans. The perforation level of 75 % creates good ventilation and heat dissipation. Optionally there is the possibility to assemble three further fans for separate cooling of the Rear I/O section. Additional fan control can be integrated. Because of the new design these CompactPCI systems are particularly favourable and space saving, comparable modular systems with vertical assembled 6 U boards including heat dissipation require 7 U. Using a 4 U system with horizontal board assembly the user will not only save money but also save 3 U system assembly height.
Typically with the CompactPCI systems for horizontal board assembly Schroff offers a fully integrated solution. These compact, space saving plug-in units are available in 1 U, 2 U, 3 U versions and now also as a 4 U version. In the 4 U version there is space for up to eight horizontal 160 mm deep boards. A system slot is at the bottom which allows to use CPUs with double width (8 HP). Additionally, there is assembly space at the rear for 80 mm deep Rear-I/O boards with IEEE guide rails including ESD clip. At the left side of the system is a front extractable hot-swap fan unit with four especially low noise fans. The perforation level of 75 % creates good ventilation and heat dissipation. Optionally there is the possibility to assemble three further fans for separate cooling of the Rear I/O section. Additional fan control can be integrated. Because of the new design these CompactPCI systems are particularly favourable and space saving, comparable modular systems with vertical assembled 6 U boards including heat dissipation require 7 U. Using a 4 U system with horizontal board assembly the user will not only save money but also save 3 U system assembly height.
Picture 1. 4 U CompactPCI system for horizontal card assembly
Continous monolithic backplane
Within CompactPCI systems Schroff has also developed a new 64 bit range of CompactPCI backplanes with Rear I/O, which conform to PICMG 2.0 Rev. 3.0. Backplanes for 6 U CompactPCI boards also conform to the Hot Swap Specification and are available for 2, 4, 6 and 8 slot versions (1, 2, 3 and 4 U). They are designed as monolithic 9 U backplanes with integrated, 3 U wide area for pluggable 3 U/8 HP power supplies with P47 connectors.
Due to the monolithic solution the amount of cabling between the power backplane and CompactPCI backplane is not applicable, voltage and ohmic drop of the cables and connectors are avoided. There are by default one or two possibilities on the power backplane for connecting (P47 connectors) 19" CompactPCI power supplies which could be used in parallel or redundantly. On a 3 U system up to 3 hot-swappable power supplies can be inserted and up to 4 on a 4 U system.
Within CompactPCI systems Schroff has also developed a new 64 bit range of CompactPCI backplanes with Rear I/O, which conform to PICMG 2.0 Rev. 3.0. Backplanes for 6 U CompactPCI boards also conform to the Hot Swap Specification and are available for 2, 4, 6 and 8 slot versions (1, 2, 3 and 4 U). They are designed as monolithic 9 U backplanes with integrated, 3 U wide area for pluggable 3 U/8 HP power supplies with P47 connectors.
Due to the monolithic solution the amount of cabling between the power backplane and CompactPCI backplane is not applicable, voltage and ohmic drop of the cables and connectors are avoided. There are by default one or two possibilities on the power backplane for connecting (P47 connectors) 19" CompactPCI power supplies which could be used in parallel or redundantly. On a 3 U system up to 3 hot-swappable power supplies can be inserted and up to 4 on a 4 U system.
Picture 2. Continuous, monolithic 4 U/8 slot CompactPCI backplane
Front panels: The individual "face" of the system
The front panels of 19" subracks or cases have to be designed individually for each project. Standard panels with and without EMC shielding, for CompactPCI, VME, AdvancedTCA systems or for Advanced Mezzanine Cards are available (Picture 3), which can be customized through the Front Panel Fast Track Service for individual machining of the front panels.
Different front panel materials conform to RoHS
For the surface treatment of front panels made of Aluminium it is common to use chrome VI to achieve certain requirements of material properties regarding corrosion resistance, conductivity and optical characteristics. RoHS (EU Directive 2002/95/EG) coming into force on 1 July 2006 demands a drastic reduction of toxic ingredients such as chrome VI. By the end of 2005 Schroff will have a solution to avoid the use of chrome VI and at the same time keep up the high-value properties of the surface. The current common colourless or yellow-chromated conductive surfaces of Aluminium will be replaced by new colourless passivated surfaces.
Picture 3. Front panels
Order front panels easy and fast on the internet
To order front panels the from Fast Track Service on the Schroff website http://www.schroff.co.uk could not be easier. It is built up in three steps: Select and download the front panel drawing in CAD format (dxf or dwg) from more than 600 standard front panels, draw in the required cut-outs and send the modified drawing to Schroff. The drawing of the front panel contains component mounting limits which show the designer which area of the front panel can be used without for example infringing the 19" specification. In addition there is also a tool library with predefined cut-outs for standardized Sub-D or Coax connectors. The last step, the so-called drawing upload requires quantity and required delivery data, attached to the file and sent to Schroff. In addition to machining like drilling, milling, taping and countersinking painting and printing of the front panels, is offered. The assembly of shielding kits and for example collar screws, handles, LPT fastener or EMC spring is also possible. The fully machined front panels will be delivered in 10 working days.
To order front panels the from Fast Track Service on the Schroff website http://www.schroff.co.uk could not be easier. It is built up in three steps: Select and download the front panel drawing in CAD format (dxf or dwg) from more than 600 standard front panels, draw in the required cut-outs and send the modified drawing to Schroff. The drawing of the front panel contains component mounting limits which show the designer which area of the front panel can be used without for example infringing the 19" specification. In addition there is also a tool library with predefined cut-outs for standardized Sub-D or Coax connectors. The last step, the so-called drawing upload requires quantity and required delivery data, attached to the file and sent to Schroff. In addition to machining like drilling, milling, taping and countersinking painting and printing of the front panels, is offered. The assembly of shielding kits and for example collar screws, handles, LPT fastener or EMC spring is also possible. The fully machined front panels will be delivered in 10 working days.
